A brief review of doping issues in III-V semiconductors

K. S. Jones, A. G. Lind, C. Hatem, S. Moffatt, M. C. Ridgway

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    23 Citations (Scopus)

    Abstract

    A brief review of n-type doping of GaAs, InGaAs and InP using ion implantation is presented. While the diffusion of the amphoteric dopant Si is not a significant issue its activation is limited to around 1×10 19/cm3. This has prompted many studies into factors that might affect dopant activation including co-implantation to force site selection, damage and amorphization effects, elevated temperature implants and capping effects. A summary of these results is discussed. With interest in using III-V materials for n-channel devices in future sub 15 nm devices there is also an increasing interest in low energy implants. This suggests the role of surface degradation upon annealing will become even more important. Recent results along these lines are presented.

    Original languageEnglish
    Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
    Pages97-105
    Number of pages9
    Edition3
    DOIs
    Publication statusPublished - 2013
    EventInternational Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting - Toronto, ON, Canada
    Duration: 12 May 201317 May 2013

    Publication series

    NameECS Transactions
    Number3
    Volume53
    ISSN (Print)1938-5862
    ISSN (Electronic)1938-6737

    Conference

    ConferenceInternational Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting
    Country/TerritoryCanada
    CityToronto, ON
    Period12/05/1317/05/13

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