A micromechanism study of thermosonic gold wire bonding on aluminum pad
- H. Xu*
- , C. Liu
- , V. V. Silberschmidt
- , S. S. Pramana
- , T. J. White
- , Z. Chen
- , M. Sivakumar
- , V. L. Acoff
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
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