Activation energy and blistering rate in hydrogen-implanted semiconductors

Daniel J. Pyke*, Robert G. Elliman, Jeffrey C. McCallum

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    Hydrogen blister rates in Si (100), Si (111) and Ge (100) substrates are compared as a function of annealing temperature and time, for a range of implant energies and fluences. For each material, the rate of blister formation was found to exhibit Arrhenius behavior and to be characterised by a single activation energy over the temperature range examined. The extracted activation energies were 2.28±0.03 eV, 2.17±0.06 eV and 1.4±0.03 eV for (100) Si; (111) Si and (100) Ge, respectively. These results are compared with reported measurements and discussed in relation to proposed models of hydrogen blistering.

    Original languageEnglish
    Title of host publicationProperties and Processes at the Nanoscale - Nanomechanics of Material Behavior
    Pages79-84
    Number of pages6
    DOIs
    Publication statusPublished - 2012
    Event2011 MRS Fall Meeting - Boston, MA, United States
    Duration: 28 Nov 20112 Dec 2011

    Publication series

    NameMaterials Research Society Symposium Proceedings
    Volume1424
    ISSN (Print)0272-9172

    Conference

    Conference2011 MRS Fall Meeting
    Country/TerritoryUnited States
    CityBoston, MA
    Period28/11/112/12/11

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