Characterization of oxygen self-diffusion in TiO2 resistive-switching layers by nuclear reaction profiling

M. C. Sulzbach, F. F. Selau*, H. Trombini, P. L. Grande, G. G. Marmitt, L. G. Pereira, M. Vos, R. G. Elliman

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    Abstract

    Oxygen self-diffusion was investigated in TiO2 layers employed for resistive-switching memories using resonant nuclear reaction profiling (NRP) and 18O labeling. The layers were grown using physical vapor deposition technique (sputtering) and were polycrystalline. The diffusivity was measured over the temperature range 600–800 °C and the activation energy for oxygen self-diffusion in sputter-deposited TiO2 films determined to be 1.09 ± 0.16 eV, a value consistent with results obtained by previous studies (Marmitt et al., 2017).

    Original languageEnglish
    Pages (from-to)8-11
    Number of pages4
    JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
    Volume441
    DOIs
    Publication statusPublished - 15 Feb 2019

    Fingerprint

    Dive into the research topics of 'Characterization of oxygen self-diffusion in TiO2 resistive-switching layers by nuclear reaction profiling'. Together they form a unique fingerprint.

    Cite this