Abstract
We present a novel CMOS-compatible fabrication technique for convex micronano lens arrays (MNLAs) with high packing density on the wafer scale. By means of conformal chemical vapor deposition (CVD) of hydrogenated amorphous silicon (a-Si:H) following patterning of silicon pillars via electron beam lithography (EBL) and plasma etching, large areas of a close packed silicon lens array with the diameter from a few micrometers down to a few hundred nanometers was fabricated. The resulting structure shows excellent surface roughness and high uniformity. The optical focusing properties of the lenses at infrared wavelengths were verified by experimental measurements and numerical simulation. This approach provides a feasible solution for fabricating silicon MNLAs compatible for next generation large scale, miniaturized optical imaging detectors and related optical devices.
Original language | English |
---|---|
Pages (from-to) | 3069-3076 |
Number of pages | 8 |
Journal | Optics Express |
Volume | 25 |
Issue number | 4 |
DOIs | |
Publication status | Published - 20 Feb 2017 |