Comparative study of the electrical and structural characterization of the sub-threshold damage in n- and p-type Si implanted with MeV ions

S. Fatima*, J. Wong-Leung, J. Fitzgerald, C. Jagadish

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

Sub-threshold damage in n and p-type Si implanted and annealed at elevated temperature is characterized using deep level transient spectroscopy (DLTS) and transmission electron microscopy (TEM). Irrespective of the ion mass, DLTS spectra show a transition or critical dose below which point defects in p-type Si and no electrically active defects in n-type Si are transformed in to extended defect signatures above this dose. DLTS observation correlates well with the TEM analysis; for the doses above critical dose extended defects are observed. Furthermore, mass of the implanted ion has been found effecting the type of extended defects even though the doses were adjusted to create a similar damage distribution for all the implanted ions.

Original languageEnglish
Pages505-508
Number of pages4
DOIs
Publication statusPublished - 1999
EventProceedings of the 1998 Conference on Optoelectronic and Microelectronic Materials and Devices - Perth, WA, Aust
Duration: 14 Dec 199816 Dec 1998

Conference

ConferenceProceedings of the 1998 Conference on Optoelectronic and Microelectronic Materials and Devices
CityPerth, WA, Aust
Period14/12/9816/12/98

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