COMPETITION BETWEEN ION BEAM INDUCED EPITAXIAL CRYSTALLIZATION AND AMORPHIZATION IN SILICON: THE ROLE OF THE DIVACANCY.

J. Linnros*, R. G. Elliman, W. L. Brown

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Citations (Scopus)

Abstract

The transition from ion induced epitaxial crystallization to planar amorphization of a preexisting amorphous layer in silicon has been investigated. The conditions for dynamic equilibrium at the transition were determined for different ion species as a function of dose rate and temperature. The critical dose rate for equilibrium varies exponentially with 1/T, exhibiting an activation energy of approximately 1. 2 eV. Furthermore, for different ions, the critical dose rate is inversely proportional to the square of the linear displacement density created by individual ions. This second order defect production process and the activation energy, which is characteristic of divacancy dissociation, suggest that the accumulation of divacancies at the amorphous/crystalline interface controls the balance between crystallization and amorphization.

Original languageEnglish
Title of host publicationMaterials Research Society Symposia Proceedings
EditorsMichael O. Thompson, S.Thomas Picraux, James S. Williams
PublisherMaterials Research Soc
Pages477-480
Number of pages4
ISBN (Print)0931837405
Publication statusPublished - 1987
Externally publishedYes
EventBeam-Solid Interact and Transient Processes - Boston, MA, USA
Duration: 1 Dec 19864 Dec 1986

Publication series

NameMaterials Research Society Symposia Proceedings
Volume74
ISSN (Print)0272-9172

Conference

ConferenceBeam-Solid Interact and Transient Processes
CityBoston, MA, USA
Period1/12/864/12/86

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