TY - GEN
T1 - Cooling of Miniature Electronic Systems Using Diamond Circuit Boards
AU - Apollo, N. V.
AU - Ahnood, A.
AU - Zhan, H.
AU - Ganesan, K.
AU - Smith, A. J.R.
AU - Prawer, S.
AU - Garrett, D. J.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/24
Y1 - 2018/7/24
N2 - The drive for miniaturization of electronic systems has led to increases in spatial power density of electronic devices, making thermal management a critical challenge. For applications which require placing electronic components into increasingly smaller areas, such as 3D IC system-in-package architectures, greater thermal loads increase the probability of device failure. In this work, we present a circuit board consisting of polycrystalline diamond which has excellent thermal conductivity and electrical resistivity. Moreover, water cooling channels are integrated into the circuit board to achieve rapid and spatially-uniform cooling compared with an alumina ceramic circuit board. The total diamond package size was 1 cm × 1 cm × 1.6 cm excluding cooling channels. It was heated with a power density of 1.1 W cm-2 and cooled with a liquid flow rate of 64.5 ml s-1. Computational fluid dynamics modelling was performed to investigate the impact of substrate material and geometry on heat spreading, hot-spot generation, and water cooling efficacy during electrical powering. High thermal conductivity substrates, such as diamond, enabled a more uniform heat distribution paving the way for achieving highly miniaturized systems with lesser constraints on the hot spot formation. Furthermore, enhanced thermal conductivity lessens a key requirement for the cooling mechanism to be placed at a close proximity to the thermal load. As a result, more compact electronics packages, including 3D architectures, are possible.
AB - The drive for miniaturization of electronic systems has led to increases in spatial power density of electronic devices, making thermal management a critical challenge. For applications which require placing electronic components into increasingly smaller areas, such as 3D IC system-in-package architectures, greater thermal loads increase the probability of device failure. In this work, we present a circuit board consisting of polycrystalline diamond which has excellent thermal conductivity and electrical resistivity. Moreover, water cooling channels are integrated into the circuit board to achieve rapid and spatially-uniform cooling compared with an alumina ceramic circuit board. The total diamond package size was 1 cm × 1 cm × 1.6 cm excluding cooling channels. It was heated with a power density of 1.1 W cm-2 and cooled with a liquid flow rate of 64.5 ml s-1. Computational fluid dynamics modelling was performed to investigate the impact of substrate material and geometry on heat spreading, hot-spot generation, and water cooling efficacy during electrical powering. High thermal conductivity substrates, such as diamond, enabled a more uniform heat distribution paving the way for achieving highly miniaturized systems with lesser constraints on the hot spot formation. Furthermore, enhanced thermal conductivity lessens a key requirement for the cooling mechanism to be placed at a close proximity to the thermal load. As a result, more compact electronics packages, including 3D architectures, are possible.
KW - 3D integrated circuit
KW - diamond
KW - microelectronics
KW - thermal management
UR - http://www.scopus.com/inward/record.url?scp=85051079912&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2018.8419569
DO - 10.1109/ITHERM.2018.8419569
M3 - Conference contribution
T3 - Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
SP - 340
EP - 344
BT - Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Y2 - 29 May 2018 through 1 June 2018
ER -