Abstract
Gallium oxide (Ga2O3) deposited by plasma-enhanced atomic layer deposition (PEALD) is shown to passivate crystalline silicon surfaces via a combination of a high negative charge and a reduction in the density of surface defects to below 1 × 1011 cm-2 eV-1 at midgap. The passivation, as determined by the injection-dependent excess carrier lifetime, is demonstrated to be commensurate to that of PEALD aluminum oxide. In addition, Ga2O3 is used as a gallium source in a laser-doping process, resulting in a device efficiency of 19.2% and an open-circuit voltage of 658 mV in a partial rear contact p-type cell design.
Original language | English |
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Article number | 7222371 |
Pages (from-to) | 1586-1590 |
Number of pages | 5 |
Journal | IEEE Journal of Photovoltaics |
Volume | 5 |
Issue number | 6 |
DOIs | |
Publication status | Published - 25 Aug 2015 |