TY - JOUR
T1 - Dual-Function Electron-Conductive, Hole-Blocking Titanium Nitride Contacts for Efficient Silicon Solar Cells
AU - Yang, Xinbo
AU - Liu, Wenzhu
AU - De Bastiani, Michele
AU - Allen, Thomas
AU - Kang, Jingxuan
AU - Xu, Hang
AU - Aydin, Erkan
AU - Xu, Lujia
AU - Bi, Qunyu
AU - Dang, Hoang
AU - AlHabshi, Esra
AU - Kotsovos, Konstantinos
AU - AlSaggaf, Ahmed
AU - Gereige, Issam
AU - Wan, Yimao
AU - Peng, Jun
AU - Samundsett, Christian
AU - Cuevas, Andres
AU - De Wolf, Stefaan
N1 - Publisher Copyright:
© 2019 Elsevier Inc.
PY - 2019/5/15
Y1 - 2019/5/15
N2 - High-performance passivating contact is a prerequisite for high-efficiency crystalline silicon (c-Si) solar cells. In this work, an electron-conductive, hole-blocking contact based on titanium nitride (TiN) deposited by reactive magnetron sputtering is presented. Quasi-metallic TiN combined with an ultrathin SiO2 passivation layer (SiO2/TiN) is demonstrated to be an effective electron-selective contact on c-Si, featuring a low-contact resistivity of 16.4 mΩ.cm2 and a tolerable recombination current parameter of ∼500 fA/cm2. By implementing the dual-function SiO2/TiN contact, which acts simultaneously as a surface passivating layer and metal electrode, an efficiency of 20% is achieved by an n-type c-Si solar cell with a simple structure. This work not only demonstrates a way to develop efficient n-type c-Si solar cells with dual-function metal nitride contacts at a low cost but also expands the pool of available carrier transport materials, from metal oxides to metal nitrides, for photovoltaic devices. N-type silicon wafers exhibit superior electrical properties compared to their p-type counterparts, such as higher minority carrier lifetime and absence of light-induced degradation, resulting in a higher efficiency potential and increased reliability of photovoltaic devices. However, most of the commonly used metals (e.g., Al and Ag) cannot form an ohmic contact on the lightly doped n-type silicon wafers, retarding the development of an n-type analog to the Al-back-surface-field p-type solar cell. Herein, we present a dual-function, electron-conductive contact based on titanium nitride (TiN) for n-type silicon solar cells. By implementing the SiO2/TiN contact, which acts simultaneously as a surface passivating layer and metal electrode, an efficiency of 20% was achieved by an n-type silicon solar cell with a simplified fabrication flow. This work demonstrates the path forward to develop efficient n-type silicon solar cells with dual-function metal nitride contacts at a low cost. Yang and co-workers reported a dual-function, low-cost, high-performance titanium-nitride-based passivating contact for silicon solar cells. By the implementation of electron-conductive titanium nitride contact, which acts simultaneously as a surface passivating layer and metal electrode, a silicon solar cell with an efficiency of 20% is achieved using a simplified fabrication process. This work also expands the pool of available electron transport materials, from metal oxides to metal nitrides, for photovoltaic devices.
AB - High-performance passivating contact is a prerequisite for high-efficiency crystalline silicon (c-Si) solar cells. In this work, an electron-conductive, hole-blocking contact based on titanium nitride (TiN) deposited by reactive magnetron sputtering is presented. Quasi-metallic TiN combined with an ultrathin SiO2 passivation layer (SiO2/TiN) is demonstrated to be an effective electron-selective contact on c-Si, featuring a low-contact resistivity of 16.4 mΩ.cm2 and a tolerable recombination current parameter of ∼500 fA/cm2. By implementing the dual-function SiO2/TiN contact, which acts simultaneously as a surface passivating layer and metal electrode, an efficiency of 20% is achieved by an n-type c-Si solar cell with a simple structure. This work not only demonstrates a way to develop efficient n-type c-Si solar cells with dual-function metal nitride contacts at a low cost but also expands the pool of available carrier transport materials, from metal oxides to metal nitrides, for photovoltaic devices. N-type silicon wafers exhibit superior electrical properties compared to their p-type counterparts, such as higher minority carrier lifetime and absence of light-induced degradation, resulting in a higher efficiency potential and increased reliability of photovoltaic devices. However, most of the commonly used metals (e.g., Al and Ag) cannot form an ohmic contact on the lightly doped n-type silicon wafers, retarding the development of an n-type analog to the Al-back-surface-field p-type solar cell. Herein, we present a dual-function, electron-conductive contact based on titanium nitride (TiN) for n-type silicon solar cells. By implementing the SiO2/TiN contact, which acts simultaneously as a surface passivating layer and metal electrode, an efficiency of 20% was achieved by an n-type silicon solar cell with a simplified fabrication flow. This work demonstrates the path forward to develop efficient n-type silicon solar cells with dual-function metal nitride contacts at a low cost. Yang and co-workers reported a dual-function, low-cost, high-performance titanium-nitride-based passivating contact for silicon solar cells. By the implementation of electron-conductive titanium nitride contact, which acts simultaneously as a surface passivating layer and metal electrode, a silicon solar cell with an efficiency of 20% is achieved using a simplified fabrication process. This work also expands the pool of available electron transport materials, from metal oxides to metal nitrides, for photovoltaic devices.
KW - electron-selective contact
KW - hole blocking
KW - passivating contact
KW - silicon solar cell
KW - titanium nitride
UR - http://www.scopus.com/inward/record.url?scp=85065490824&partnerID=8YFLogxK
U2 - 10.1016/j.joule.2019.03.008
DO - 10.1016/j.joule.2019.03.008
M3 - Article
SN - 2542-4351
VL - 3
SP - 1314
EP - 1327
JO - Joule
JF - Joule
IS - 5
ER -