Effect of crystallization on the reliability of unipolar resistive-switching in HfO2-based dielectrics

M. N. Saleh, D. K. Venkatachalam, R. G. Elliman*

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    5 Citations (Scopus)

    Abstract

    The electroforming and unipolar resistive switching characteristics of as-deposited and annealed HfO2 and Hf0.6Si 0.4O2 films are reported. The reliability of HfO 2 devices is shown to be significantly degraded by annealing at 600 °C, during which the film is observed to crystallize. In contrast, the characteristics of Hf0.6Si0.4O2 devices subjected to the same annealing conditions are found to be unchanged, consistent with the fact that the films remain amorphous. These differences are attributed to the presence of grain boundaries and can have important implications for the use of HfO2 in ReRAM applications.

    Original languageEnglish
    Pages (from-to)S88-S92
    JournalCurrent Applied Physics
    Volume14
    Issue numberSUPPL. 1
    DOIs
    Publication statusPublished - 14 Mar 2014

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