Effect of temperature and incident ion energy on nanostructure formation on silicon exposed to helium plasma

Matt Thompson*, Quan Shi, Shin Kajita, Noriyasu Ohno, Cormac Corr

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    Helium plasma can be used to deliver low-energy (<100 eV) helium ions to stimulate the growth of nanostructures on silicon surfaces. This can produce a wide range of surface features including nanoscale roughening, nanowires and porous structures. In this study, nanostructure sizes varied from ∼10 to over 100 nm in diameter. The effect of these structures on surface reflectivity for photovoltaic and photocatalytic applications is also investigated. Broadband suppression of photoreflectivity is achieved across the 300–1,200 nm wavelength range studied for silicon exposed to helium plasma at 600°C, with an average reflectivity of 3.2% and 2.9% for incident helium ion energies of 42 and 62 eV, respectively.

    Original languageEnglish
    Article number2000126
    JournalPlasma Processes and Polymers
    Volume17
    Issue number12
    DOIs
    Publication statusPublished - Dec 2020

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