Abstract
In recent years, excellent surface passivation has been achieved on both p-type and n-type surfaces of silicon wafers and solar cells using aluminum oxide deposited by plasmaassisted atomic layer deposition. However, alternative deposition methods may offer practical advantages for large-scale manufacturing of solar cells. In this letter we show that radiofrequency magnetron sputtering is capable of depositing negatively-charged aluminum oxide and achieving good surface passivation both on p-type and n-type silicon wafers. We thus establish that sputtered aluminum oxide is a very promising method for the surface passivation of high efficiency solar cells.
Original language | English |
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Pages (from-to) | 160-162 |
Number of pages | 3 |
Journal | Physica Status Solidi - Rapid Research Letters |
Volume | 3 |
Issue number | 5 |
DOIs | |
Publication status | Published - 2009 |