Abstract
The efficient gettering to hydrogen-induced cavities in Si has been successfully demonstrated for low concentrations of Cu, unintentionally introduced during wafer processing. Secondary ion mass spectrometry showed up to 5×1012cm-2Cu could be introduced into a silicon wafer and trapped at cavities. Neutron activation analysis indicated that, in samples with cavities, the Cu within the bulk was below the detection limit (around 4×1011cm-2), while Cu was detected throughout the bulk of samples without cavities.
| Original language | English |
|---|---|
| Pages (from-to) | 2639-2641 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 73 |
| Issue number | 18 |
| DOIs | |
| Publication status | Published - 1998 |