Abstract
Low refractive index polymer materials have been investigated with a view to form the back surface mirror of advanced silicon solar cells. SiOx:H or AlOy SiOx:H polymer films were spun on top of an ultra-thin (<10 nm) atomic-layer-deposited (ALD) Al2O3 layer, itself deposited on low-resistivity (1 Ω cm) p-type crystalline silicon wafers. These double-layer stacks were compared to both ALD Al2O3 single layers and ALD Al2O3/plasma-enhanced chemical vapour deposited (PECVD) SiNx stacks, in terms of surface passivation, firing stability and rear-side reflection. Very low surface recombination velocity (SRV) values approaching 3 cm/s were achieved with ALD Al2O3 layers in the 4-8 nm range. Whilst the surface passivation of the single ALD Al2O3 layer is maintained after a standard firing step typical of screen printing metallisation, a harsher firing regime revealed an enhanced thermal stability of the ALD Al2O3/SiOx:H and ALD Al2O3/AlOy SiOx:H stacks. Using simple two-dimensional optical modelling of rear-side reflection it is shown that the low refractive index exhibited by SiOx:H and AlOy SiOx:H results in superior optical performance as compared to PECVD SiNx, with gains in photogenerated current of ~0.125 mA/cm2 at a capping thickness of 100 nm. (
Original language | English |
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Pages (from-to) | 530-533 |
Number of pages | 4 |
Journal | Physica Status Solidi - Rapid Research Letters |
Volume | 7 |
Issue number | 8 |
DOIs | |
Publication status | Published - Aug 2013 |