Enhancement of thin metallic film adhesion following vacuum ultraviolet irradiation

I. V. Mitchell*, G. Nyberg, R. G. Elliman

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)

Abstract

The adhesion of thin metallic films to silicon substrates is shown to improve following irradiation with a flux of either 21.2-eV (He I) 10.2-eV (H Lyman α) photons. The improved adhesion is similar to that found following MeV energy ion irradiation and keV energy electron irradiation, adding support to the view that electronic excitation and/or ionization and precursors to the stronger bonding configuration.

Original languageEnglish
Pages (from-to)137-139
Number of pages3
JournalApplied Physics Letters
Volume45
Issue number2
DOIs
Publication statusPublished - 1984
Externally publishedYes

Fingerprint

Dive into the research topics of 'Enhancement of thin metallic film adhesion following vacuum ultraviolet irradiation'. Together they form a unique fingerprint.

Cite this