Fabrication of high-speed electronic devices of ion-beam synthesis of Ge XSi 1-X strained layers

R. G. Elliman*, H. Jiang, W. C. Wong, P. Kringhoj

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

Ge XSi 1-X strained layers can be fabricated by Ge implantation and solid-phase epitaxy and can be used in electronic devices to improved their performance. Several important materials science issues are addressed, including the effect of the strain on solid-phase-epitaxy, the effect of oxidation on the implanted Ge distribution, and the effect of Ge on the oxidation rate of Si. The potential of this process is demonstrated by comparing the performance of metal-oxide-semiconductor field-effect-transistors (MOSFETs) employing ion-beam synthesised GeSi strained layer channel regions with that of Si-only devices.

Original languageEnglish
Pages (from-to)217-222
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume438
Publication statusPublished - 1996
EventProceedings of the 1996 MRS Fall Meeting - Boston, MA, USA
Duration: 2 Dec 19966 Dec 1996

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