@inproceedings{ad1e65b69a0143af94291e2e8df3dadc,
title = "Fabrication tolerant planar directional couplers",
abstract = "Hybrid integration of different materials will allow for different functionalities such as passive, amplifying, nonlinear, electro-optic, detection etc to build {"}system on a chip{"} devices. The vertically stacked layer design commonly proposed significantly increases the difficulty of the lithography process for the bottom-most layer due to the overlying topology. A methodology for significantly improving the fabrication tolerance of planar directional couplers is therefore presented. A parametric design study reveals that significant dimensional sensitivity improvements exist for certain center-To-center spacings for both power and wavelength splitters.",
keywords = "directional coupler, Hybrid integrated optical circuits",
author = "Lai, {C. K.} and Zhong, {Y. L.} and T. Han and Chong, {W. Y.} and Choi, {D. Y.} and Goldsmith, {H. D.K.} and P. Ma and H. Ahmad and S. Madden",
note = "Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; AOS Australian Conference on Optical Fibre Technology, ACOFT 2019 and Australian Conference on Optics, Lasers, and Spectroscopy, ACOLS 2019 ; Conference date: 09-12-2019 Through 12-12-2019",
year = "2019",
doi = "10.1117/12.2540497",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Arnan Mitchell and Halina Rubinsztein-Dunlop",
booktitle = "AOS Australian Conference on Optical Fibre Technology, ACOFT 2019 and Australian Conference on Optics, Lasers, and Spectroscopy, ACOLS 2019",
address = "United States",
}