TY - GEN
T1 - Formation of ordered arrays of gold particles on silicon and silicon-dioxide by nanoindentation patterning
AU - Ruffell, S.
AU - Venkatachalam, D. K.
AU - Shalav, A.
AU - Elliman, R. G.
PY - 2010
Y1 - 2010
N2 - Ordered arrays of gold particles have been fabricated on gold-coated Si(100) surfaces by pre-patterning the surface with a nanoindenter. During thermal annealing the Au is observed to accumulate within the residual indents. Once nucleated, the Au particles grow at the expense of smaller surface particles via an Ostwald-ripening process. The size of the Au particles is controlled by the initial thickness of the deposited Au layer, the size of the indentation (which is controlled with a high degree of precision), and the annealing conditions. Particles of ∼200 nm dimensions are formed in indents of ∼1 μm dimensions whilst nanoparticles of ∼20 nm are observed in the smallest indents made (∼50 nm). We have also demonstrated patterning of Au by indentation of a Au layer sandwiched between two SiO2 films deposited on Si by plasma-enhanced chemical vapour deposition. Here, cracking of the SiO2 layer occurs allowing Au to diffuse to the surface at the indented locations during post-indentation annealing.
AB - Ordered arrays of gold particles have been fabricated on gold-coated Si(100) surfaces by pre-patterning the surface with a nanoindenter. During thermal annealing the Au is observed to accumulate within the residual indents. Once nucleated, the Au particles grow at the expense of smaller surface particles via an Ostwald-ripening process. The size of the Au particles is controlled by the initial thickness of the deposited Au layer, the size of the indentation (which is controlled with a high degree of precision), and the annealing conditions. Particles of ∼200 nm dimensions are formed in indents of ∼1 μm dimensions whilst nanoparticles of ∼20 nm are observed in the smallest indents made (∼50 nm). We have also demonstrated patterning of Au by indentation of a Au layer sandwiched between two SiO2 films deposited on Si by plasma-enhanced chemical vapour deposition. Here, cracking of the SiO2 layer occurs allowing Au to diffuse to the surface at the indented locations during post-indentation annealing.
UR - http://www.scopus.com/inward/record.url?scp=77957762126&partnerID=8YFLogxK
M3 - Conference contribution
SN - 9781617387593
T3 - Materials Research Society Symposium Proceedings
SP - 36
EP - 41
BT - Nanoscale Pattern Formation
T2 - 2009 MRS Fall Meeting
Y2 - 30 November 2009 through 4 December 2009
ER -