Fracture analysis in plane piezoelectric media using hybrid finite element model

Hui Wang, Qing Hua Qin*

*Corresponding author for this work

    Research output: Contribution to conferencePaperpeer-review

    2 Citations (Scopus)

    Abstract

    A two-dimensional electroelastic fracture analysis is performed on a plane piezoelectric material by the finite element model based on fundamental solution approximation. In the present element model, the fundamental solution of the piezoelectric problem is employed to construct the intra-element fields to make the final stiffness equation containing element boundary integrals only. Solving the stiffness equation can yield nodal displacement and electric potential, which are in turn used to evaluate the stress intensity factor and electric intensity factor by way of extrapolation techniques. Numerical results are provided to show the accuracy of the present method.

    Original languageEnglish
    Pages3240-3246
    Number of pages7
    Publication statusPublished - 2013
    Event13th International Conference on Fracture 2013, ICF 2013 - Beijing, China
    Duration: 16 Jun 201321 Jun 2013

    Conference

    Conference13th International Conference on Fracture 2013, ICF 2013
    Country/TerritoryChina
    CityBeijing
    Period16/06/1321/06/13

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