High-energy ion implantation for electrical isolation of InP-based materials and devices

M. C. Ridgway*, R. G. Elliman, M. E. Faith, P. C. Kemeny, M. Davies

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

The application of high-energy ion implantation for electrical isolation of InP-based materials and devices is described and damage- and chemically-related compensation mechanisms are compared. The former is shown to result in excessive dark current in InGaAs/InP p-i-n photodiodes due to the low intrinsic resistivity of InGaAs and the presence of residual disorder. While chemically-related compensation minimizes residual disorder, the application of this technology is often limited by diffusion and/or the low solid solubility of the deep dopant as demonstrated in both Fe- and Au-implanted InP.

Original languageEnglish
Pages (from-to)323-326
Number of pages4
JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Volume96
Issue number1-2
DOIs
Publication statusPublished - 1 Mar 1995

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