TY - GEN
T1 - Investigation of lifetime degradation of RIE-processed silicon samples for solar cells
AU - Zin, Ngwe Soe
AU - Blakers, Andrew
AU - Weber, Klaus
AU - Zhang, Chun
PY - 2009
Y1 - 2009
N2 - Reactive Ion Etching (RIE) is observed to cause substantial effective carrier lifetime degradation in silicon wafers. Degradation of lifetime is permanent for samples where RIE etches into silicon, while the lifetime degradation is temporary for samples where RIE etches only dielectric layers of SiO2 grown on the wafer. The degradation of the effective lifetime of RIE-etched silicon samples can be minimized by exposing only a few percent of the wafer to the etch.
AB - Reactive Ion Etching (RIE) is observed to cause substantial effective carrier lifetime degradation in silicon wafers. Degradation of lifetime is permanent for samples where RIE etches into silicon, while the lifetime degradation is temporary for samples where RIE etches only dielectric layers of SiO2 grown on the wafer. The degradation of the effective lifetime of RIE-etched silicon samples can be minimized by exposing only a few percent of the wafer to the etch.
UR - http://www.scopus.com/inward/record.url?scp=77951601320&partnerID=8YFLogxK
U2 - 10.1109/PVSC.2009.5411762
DO - 10.1109/PVSC.2009.5411762
M3 - Conference contribution
SN - 9781424429509
T3 - Conference Record of the IEEE Photovoltaic Specialists Conference
SP - 39
EP - 43
BT - 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
T2 - 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
Y2 - 7 June 2009 through 12 June 2009
ER -