Investigation of lifetime degradation of RIE-processed silicon samples for solar cells

Ngwe Soe Zin, Andrew Blakers, Klaus Weber, Chun Zhang

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Citations (Scopus)

    Abstract

    Reactive Ion Etching (RIE) is observed to cause substantial effective carrier lifetime degradation in silicon wafers. Degradation of lifetime is permanent for samples where RIE etches into silicon, while the lifetime degradation is temporary for samples where RIE etches only dielectric layers of SiO2 grown on the wafer. The degradation of the effective lifetime of RIE-etched silicon samples can be minimized by exposing only a few percent of the wafer to the etch.

    Original languageEnglish
    Title of host publication2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
    Pages39-43
    Number of pages5
    DOIs
    Publication statusPublished - 2009
    Event2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009 - Philadelphia, PA, United States
    Duration: 7 Jun 200912 Jun 2009

    Publication series

    NameConference Record of the IEEE Photovoltaic Specialists Conference
    ISSN (Print)0160-8371

    Conference

    Conference2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
    Country/TerritoryUnited States
    CityPhiladelphia, PA
    Period7/06/0912/06/09

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