Ion-implantation in SiC and GaN

N. Papanicolaou, M. V. Rao*, B. Molnar, J. Tucker, A. Edwards, O. W. Holland, M. C. Ridgway

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    5 Citations (Scopus)

    Abstract

    The electrical activation behavior of N- and Al-implantations in bulk V-doped semi-insulating 4H-SiC is similar to that in 4H-SiC epitaxial layers. The As- and Sb-implantations in p-type 6H-SiC epitaxial layers showed out-diffusion behavior with room-temperature sheet carrier concentrations of <20% of the implanted dose. In n-type GaN, compensating levels introduced by the high-dose implantation damage are thermally stable even at 1150°C annealing.

    Original languageEnglish
    Pages (from-to)416-420
    Number of pages5
    JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
    Volume148
    Issue number1-4
    DOIs
    Publication statusPublished - 1999

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