TY - JOUR
T1 - Isotextured silicon solar cell analysis and modeling 2
T2 - Recombination and device modeling
AU - Baker-Finch, Simeon C.
AU - McIntosh, Keith R.
AU - Terry, Mason L.
AU - Wan, Yimao
PY - 2012
Y1 - 2012
N2 - We extend our analysis of isotextured silicon solar cells by 1) examining experimentally the role played by isotexture in determining the surface recombination velocity at silicon surfaces and 2) combining these experimental results with our model for photogeneration in order to simulate in one dimension typical solar cell devices with isotextured surfaces. We examine both undiffused and diffused n-type isotextured silicon surfaces, and we find that the rate of surface recombination usually decreases with increasing isotexture etch depth. However, when undiffused surfaces are passivated with hydrogenated SiO 2or SiN x , surface recombination velocity is, counterintuitively perhaps, found to be independent of surface texturethis is despite a surface area that is up to 1.9-fold larger than a planar equivalent. We demonstrate the utility of our analysis of isotextured surfaces by simulating various device structures in one dimension. In one case, where device parameters are chosen to approximate a typical screen-printed cell with full-area back surface field, simulation results indicate that the optimal isotexture etch depth is 1-3μm. This optimum etch depth is slightly below the one deduced from published experimental results, indicating that surface recombination on samples observed in this study is uniquely independent of isotexture morphology.
AB - We extend our analysis of isotextured silicon solar cells by 1) examining experimentally the role played by isotexture in determining the surface recombination velocity at silicon surfaces and 2) combining these experimental results with our model for photogeneration in order to simulate in one dimension typical solar cell devices with isotextured surfaces. We examine both undiffused and diffused n-type isotextured silicon surfaces, and we find that the rate of surface recombination usually decreases with increasing isotexture etch depth. However, when undiffused surfaces are passivated with hydrogenated SiO 2or SiN x , surface recombination velocity is, counterintuitively perhaps, found to be independent of surface texturethis is despite a surface area that is up to 1.9-fold larger than a planar equivalent. We demonstrate the utility of our analysis of isotextured surfaces by simulating various device structures in one dimension. In one case, where device parameters are chosen to approximate a typical screen-printed cell with full-area back surface field, simulation results indicate that the optimal isotexture etch depth is 1-3μm. This optimum etch depth is slightly below the one deduced from published experimental results, indicating that surface recombination on samples observed in this study is uniquely independent of isotexture morphology.
KW - Photovoltaic cells
KW - semiconductor device modeling
KW - silicon
KW - surface passivation
KW - surface recombination
KW - surface texture
UR - http://www.scopus.com/inward/record.url?scp=84866742839&partnerID=8YFLogxK
U2 - 10.1109/JPHOTOV.2012.2204390
DO - 10.1109/JPHOTOV.2012.2204390
M3 - Article
SN - 2156-3381
VL - 2
SP - 465
EP - 472
JO - IEEE Journal of Photovoltaics
JF - IEEE Journal of Photovoltaics
IS - 4
M1 - 6235972
ER -