Material combination of Tunnel-SiO2 with a (sub-)Monolayer of ALD-AlOx on silicon offering a highly passivating hole selective contact

Daniel Hiller*, Philipp Hoenicke, Dirk König*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Abstract

In this work, we investigate a passivating hole-selective tunnel contact on crystalline silicon (Si) based on an ultrathin thermal SiO2 and a (sub-)monolayer thick aluminum oxide (AlOx) deposited by atomic layer deposition (ALD) with 1 to 7 cycles. Rapid thermal annealing (RTA) is essential to activate the passivation and intense visible light is demonstrated to play a key role in the formation and occupation of the Al-induced acceptor states in SiO2 that provide the passivation. This simple stack provides very good surface passivation on n-type Si with a surface saturation current density as low as J0s = 25 fA/cm2 (Seff = 2.7 cm/s) and a contact resistivity ρc of ~200 mΩ cm2, while being Si-dopant-free, fully transparent and firing-stable. The Al-deposition on thermal SiO2 during the initial ALD-cycles is studied carefully by synchrotron-based reference-free grazing incidence X-ray fluorescence spectrometry (GIXRF). Different metallization and capping approaches are tested and discussed.

Original languageEnglish
Article number110654
Number of pages8
JournalSolar Energy Materials and Solar Cells
Volume215
Early online date19 Jun 2020
DOIs
Publication statusPublished - 15 Sept 2020

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