Abstract
In this work, we investigate a passivating hole-selective tunnel contact on crystalline silicon (Si) based on an ultrathin thermal SiO2 and a (sub-)monolayer thick aluminum oxide (AlOx) deposited by atomic layer deposition (ALD) with 1 to 7 cycles. Rapid thermal annealing (RTA) is essential to activate the passivation and intense visible light is demonstrated to play a key role in the formation and occupation of the Al-induced acceptor states in SiO2 that provide the passivation. This simple stack provides very good surface passivation on n-type Si with a surface saturation current density as low as J0s = 25 fA/cm2 (Seff = 2.7 cm/s) and a contact resistivity ρc of ~200 mΩ cm2, while being Si-dopant-free, fully transparent and firing-stable. The Al-deposition on thermal SiO2 during the initial ALD-cycles is studied carefully by synchrotron-based reference-free grazing incidence X-ray fluorescence spectrometry (GIXRF). Different metallization and capping approaches are tested and discussed.
Original language | English |
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Article number | 110654 |
Number of pages | 8 |
Journal | Solar Energy Materials and Solar Cells |
Volume | 215 |
Early online date | 19 Jun 2020 |
DOIs | |
Publication status | Published - 15 Sept 2020 |