Maximizing electrical activation of ion-implanted Si in In 0.53Ga0.47As

A. G. Lind*, N. G. Rudawski, N. J. Vito, C. Hatem, M. C. Ridgway, R. Hengstebeck, B. R. Yates, K. S. Jones

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    15 Citations (Scopus)

    Abstract

    A relationship between the electrical activation of Si in ion-implanted In0.53Ga0.47As and material microstructure after ion implantation is demonstrated. By altering specimen temperature during ion implantation to control material microstructure, it is advanced that increasing sub-amorphizing damage (point defects) from Si+ implantation results in enhanced electrical activation of Si in In0.53Ga0.47As by providing a greater number of possible sites for substitutional incorporation of Si into the crystal lattice upon subsequent annealing.

    Original languageEnglish
    Article number232102
    JournalApplied Physics Letters
    Volume103
    Issue number23
    DOIs
    Publication statusPublished - 2 Dec 2013

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