Abstract
A relationship between the electrical activation of Si in ion-implanted In0.53Ga0.47As and material microstructure after ion implantation is demonstrated. By altering specimen temperature during ion implantation to control material microstructure, it is advanced that increasing sub-amorphizing damage (point defects) from Si+ implantation results in enhanced electrical activation of Si in In0.53Ga0.47As by providing a greater number of possible sites for substitutional incorporation of Si into the crystal lattice upon subsequent annealing.
| Original language | English |
|---|---|
| Article number | 232102 |
| Journal | Applied Physics Letters |
| Volume | 103 |
| Issue number | 23 |
| DOIs | |
| Publication status | Published - 2 Dec 2013 |
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