Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films

Katherine Booker; Shakir Rahman; Maureen Brauers; Erin Crisp; Klaus Weber; Andrew Blakers

doi:10.1109/PVSC.2015.7356335

Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films

Katherine Booker, Shakir Rahman, Maureen Brauers, Erin Crisp, Klaus Weber, Andrew Blakers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

Metal-assisted etching can be used to etch high aspect ratio structures in silicon (Si) wafers. Using Au as catalytic metal, we have developed a simple and robust technique which allows very high aspect ratio structures to be etched on n-type substrates. For example, arrays of hundreds of narrow (10μm) and long (85mm) trenches can be etched completely through a 650μm thick wafer in order to harvest silicon for solar cells using the SLIVER technique. We have developed a method for controlling the porosity of deposited Au films with thicknesses of 10nm-30nm in order to achieve uniform etching.

Original language	English
Title of host publication	2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479979448
DOIs	https://doi.org/10.1109/PVSC.2015.7356335
Publication status	Published - 14 Dec 2015
Event	42nd IEEE Photovoltaic Specialist Conference, PVSC 2015 - New Orleans, United States Duration: 14 Jun 2015 → 19 Jun 2015

Publication series

Name	2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015

Conference

Conference	42nd IEEE Photovoltaic Specialist Conference, PVSC 2015
Country/Territory	United States
City	New Orleans
Period	14/06/15 → 19/06/15

Access to Document

10.1109/PVSC.2015.7356335

Cite this

Booker, K., Rahman, S., Brauers, M., Crisp, E., Weber, K., & Blakers, A. (2015). Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films. In 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015 Article 7356335 (2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2015.7356335

Booker, Katherine ; Rahman, Shakir ; Brauers, Maureen et al. / Metal-assisted etching of high aspect ratio structures for solar cell applications : Controlling the porosity of Au thin films. 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. (2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015).

@inproceedings{acf79e4f47e942c0a3fa3424461f2851,

title = "Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films",

abstract = "Metal-assisted etching can be used to etch high aspect ratio structures in silicon (Si) wafers. Using Au as catalytic metal, we have developed a simple and robust technique which allows very high aspect ratio structures to be etched on n-type substrates. For example, arrays of hundreds of narrow (10μm) and long (85mm) trenches can be etched completely through a 650μm thick wafer in order to harvest silicon for solar cells using the SLIVER technique. We have developed a method for controlling the porosity of deposited Au films with thicknesses of 10nm-30nm in order to achieve uniform etching.",

keywords = "etching, gold, microfabrication, optics, silicon, sliver",

author = "Katherine Booker and Shakir Rahman and Maureen Brauers and Erin Crisp and Klaus Weber and Andrew Blakers",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 42nd IEEE Photovoltaic Specialist Conference, PVSC 2015 ; Conference date: 14-06-2015 Through 19-06-2015",

year = "2015",

month = dec,

day = "14",

doi = "10.1109/PVSC.2015.7356335",

language = "English",

series = "2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015",

address = "United States",

}

Booker, K, Rahman, S, Brauers, M, Crisp, E, Weber, K & Blakers, A 2015, Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films. in 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015., 7356335, 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015, Institute of Electrical and Electronics Engineers Inc., 42nd IEEE Photovoltaic Specialist Conference, PVSC 2015, New Orleans, United States, 14/06/15. https://doi.org/10.1109/PVSC.2015.7356335

Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films. / Booker, Katherine; Rahman, Shakir; Brauers, Maureen et al.
2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7356335 (2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Metal-assisted etching of high aspect ratio structures for solar cell applications

T2 - 42nd IEEE Photovoltaic Specialist Conference, PVSC 2015

AU - Booker, Katherine

AU - Rahman, Shakir

AU - Brauers, Maureen

AU - Crisp, Erin

AU - Weber, Klaus

AU - Blakers, Andrew

PY - 2015/12/14

Y1 - 2015/12/14

N2 - Metal-assisted etching can be used to etch high aspect ratio structures in silicon (Si) wafers. Using Au as catalytic metal, we have developed a simple and robust technique which allows very high aspect ratio structures to be etched on n-type substrates. For example, arrays of hundreds of narrow (10μm) and long (85mm) trenches can be etched completely through a 650μm thick wafer in order to harvest silicon for solar cells using the SLIVER technique. We have developed a method for controlling the porosity of deposited Au films with thicknesses of 10nm-30nm in order to achieve uniform etching.

AB - Metal-assisted etching can be used to etch high aspect ratio structures in silicon (Si) wafers. Using Au as catalytic metal, we have developed a simple and robust technique which allows very high aspect ratio structures to be etched on n-type substrates. For example, arrays of hundreds of narrow (10μm) and long (85mm) trenches can be etched completely through a 650μm thick wafer in order to harvest silicon for solar cells using the SLIVER technique. We have developed a method for controlling the porosity of deposited Au films with thicknesses of 10nm-30nm in order to achieve uniform etching.

KW - etching

KW - gold

KW - microfabrication

KW - optics

KW - silicon

KW - sliver

UR - http://www.scopus.com/inward/record.url?scp=84961616497&partnerID=8YFLogxK

U2 - 10.1109/PVSC.2015.7356335

DO - 10.1109/PVSC.2015.7356335

M3 - Conference contribution

T3 - 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015

BT - 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 14 June 2015 through 19 June 2015

ER -

Booker K, Rahman S, Brauers M, Crisp E, Weber K , Blakers A. Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films. In 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7356335. (2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015). doi: 10.1109/PVSC.2015.7356335

Metal-assisted etching of high aspect ratio structures for solar cell applications: Controlling the porosity of Au thin films

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this