MeV ion-beam annealing of semiconductor structures

J. S. Williams*, M. C. Ridgway, R. G. Elliman, J. A. Davies, S. T. Johnson, G. R. Palmer

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

MeV heavy-ion beams have been used to induce epitaxial crystallization of amorphous Si, GaAs, InP, Ge-Si alloy and metal silicide layers. In all cases, the crystallization kinetics and the quality of the recrystallized layers have been compared with thermal-annealing behaviour. The most striking differences between the two annealing regimes (thermal and ion beam) have been observed for InP and high-dose In-implanted Si, where ion-beam annealing at low temperatures results in more extensive and higher-quality epitaxy than that achieved by thermal annealing.

Original languageEnglish
Pages (from-to)602-606
Number of pages5
JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Volume55
Issue number1-4
DOIs
Publication statusPublished - 2 Apr 1991

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