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Modulated interlayer charge transfer dynamics in a monolayer TMD/metal junction

  • Linglong Zhang*
  • , Han Yan
  • , Xueqian Sun
  • , Miheng Dong
  • , Tanju Yildirim
  • , Bowen Wang
  • , Bo Wen
  • , Guru Prakash Neupane
  • , Ankur Sharma
  • , Yi Zhu
  • , Jian Zhang
  • , Kun Liang
  • , Boqing Liu
  • , Hieu T. Nguyen
  • , Daniel Macdonald
  • , Yuerui Lu
  • *Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    43 Citations (Scopus)

    Abstract

    The performance of optoelectronic devices based on monolayer transition-metal dichalcogenide (mTMD) semiconductors is significantly affected by the contact at the mTMD-metal interface, which is dependent on interlayer interactions and coupling. Here, we report a systematic optical method to investigate the interlayer charge transfer and coupling in a mTMD-metal heterojunction. Giant photoluminescence (PL) quenching was observed in a monolayer MoS 2 /Pd (1L MoS 2 /Pd) junction which is mainly due to the efficient interlayer charge transfer between Pd and MoS 2 . 1L MoS 2 /Pd also exhibits an increase in the PL quenching factor (η) as the temperature decreases, due to a reduction of the interlayer spacing. Annealing experiments were also performed which supported interlayer charge transfer as the main mechanism for the increase of η. Moreover, a monolayer MoS 2 /Au (1L MoS 2 /Au) junction was fabricated for engineering the interlayer charge transfer. Interestingly, a narrowing effect of the full width at half maximum (FWHM) was encountered as the junctions changed from 1L MoS 2 /SiO 2 → 1L MoS 2 /Au → 1L MoS 2 /Pd, possibly originating from a change of the doping level induced weakening of exciton-carrier scattering. Our results deepen the understanding of metal-semiconductor junctions for further exploring fundamental phenomena and enabling high-performance devices using mTMD-metal junctions.

    Original languageEnglish
    Pages (from-to)418-425
    Number of pages8
    JournalNanoscale
    Volume11
    Issue number2
    DOIs
    Publication statusPublished - 14 Jan 2019

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