Nanomechanical properties of sputter-deposited HfO2 and Hf xSi1-xO2 thin films

D. K. Venkatachalam*, J. E. Bradby, M. N. Saleh, S. Ruffell, R. G. Elliman

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    31 Citations (Scopus)

    Abstract

    The mechanical properties of sputter-deposited HfO2 and Hf xSi1-xO2 films were studied as a function of composition using nanoindentation. The elastic modulus and hardness were measured at room temperature for as-deposited films of varying Hf content and for films subjected to annealing at 1000 °C. The elastic modulus and hardness of as-deposited films were found to increase monotonically with increasing HfO2 content, with the hardness increasing from 5.0 ± 0.3 GPa for pure SiO2 to 8.4 ± 0.4 GPa for pure HfO2. All films were found to be harder after annealing at 1000°C, with the increase for SiO2 films attributed to densification of the SiO2 network and that for the Hf xSi1-xO2 films to a combination of phase separation, densification, and crystallization.

    Original languageEnglish
    Article number043527
    JournalJournal of Applied Physics
    Volume110
    Issue number4
    DOIs
    Publication statusPublished - 15 Aug 2011

    Fingerprint

    Dive into the research topics of 'Nanomechanical properties of sputter-deposited HfO2 and Hf xSi1-xO2 thin films'. Together they form a unique fingerprint.

    Cite this