New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

H. Xu; C. Liu; V. V. Silberschmidt; S. S. Pramana; T. J. White; Z. Chenc; V. L. Acoffa

doi:10.1016/j.scriptamat.2011.06.050

New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

H. Xu^*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chenc, V. L. Acoffa

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

31 Citations (Scopus)

Abstract

This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

Original language	English
Pages (from-to)	642-645
Number of pages	4
Journal	Scripta Materialia
Volume	65
Issue number	7
DOIs	https://doi.org/10.1016/j.scriptamat.2011.06.050
Publication status	Published - Oct 2011

Access to Document

10.1016/j.scriptamat.2011.06.050

Cite this

@article{433782458e854acb9a4cdc9d6734b18b,

title = "New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation",

abstract = "This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.",

keywords = "Intermetallic compounds, Oxidation, Transmission electron microscopy (TEM), Void, Wire bonding",

author = "H. Xu and C. Liu and Silberschmidt, {V. V.} and Pramana, {S. S.} and White, {T. J.} and Z. Chenc and Acoffa, {V. L.}",

year = "2011",

month = oct,

doi = "10.1016/j.scriptamat.2011.06.050",

language = "English",

volume = "65",

pages = "642--645",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "7",

}

TY - JOUR

T1 - New mechanisms of void growth in Au-Al wire bonds

T2 - Volumetric shrinkage and intermetallic oxidation

AU - Xu, H.

AU - Liu, C.

AU - Silberschmidt, V. V.

AU - Pramana, S. S.

AU - White, T. J.

AU - Chenc, Z.

AU - Acoffa, V. L.

PY - 2011/10

Y1 - 2011/10

N2 - This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

AB - This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

KW - Intermetallic compounds

KW - Oxidation

KW - Transmission electron microscopy (TEM)

KW - Void

KW - Wire bonding

UR - http://www.scopus.com/inward/record.url?scp=84861512070&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2011.06.050

DO - 10.1016/j.scriptamat.2011.06.050

M3 - Article

SN - 1359-6462

VL - 65

SP - 642

EP - 645

JO - Scripta Materialia

JF - Scripta Materialia

IS - 7

ER -

New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

Abstract

Access to Document

Other files and links

Fingerprint

Cite this