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On the nitridation of silicon by low energy nitrogen bombardment

  • M. Petravić*
  • , J. S. Williams
  • , M. Conway
  • , P. N.K. Deenapanray
  • *Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    High-resolution Rutherford backscattering and channeling has been used to study the formation of surface nitrides during room temperature bombardment of silicon with nitrogen in a secondary ion mass spectrometry system. Slightly N-rich silicon nitride is formed at angles of incidence (to the surface normal) <27°. Nitrogen buildup profile exhibits several intense oscillations before reaching a constant level. Implanted metals were found to show little tendency for segregation under nitrogen bombardment even when a silicon nitride layer forms at the surface.

    Original languageEnglish
    Pages (from-to)1287-1289
    Number of pages3
    JournalApplied Physics Letters
    Volume73
    Issue number9
    DOIs
    Publication statusPublished - 1998

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