Oxygen diffusion in TiO2 films studied by electron and ion Rutherford backscattering

G. G. Marmitt*, S. K. Nandi, D. K. Venkatachalam, R. G. Elliman, M. Vos, P. L. Grande

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    22 Citations (Scopus)

    Abstract

    The diffusivity of oxygen in thin, sputter-deposited TiO2 films, as can be used in RRAMs, is measured using electron and ion backscattering techniques. The as-grown sample consisted of two layers (Ti16O2 and Ti18O2) and was annealed between 500 °C and 900 °C. The depth profiles of 18O, as measured with both techniques, were similar. The extent of diffusion was much larger than expected from the literature data for O diffusion in single-crystal rutile, suggesting that defects in the sputter-deposited film play an essential role in the diffusion process.

    Original languageEnglish
    Pages (from-to)97-102
    Number of pages6
    JournalThin Solid Films
    Volume629
    DOIs
    Publication statusPublished - 1 May 2017

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