Abstract
A technique to make poly-Si (p+)/SiOx contacts for crystalline silicon solar cells based on doping PECVD intrinsic amorphous silicon (a-Si) by means of a thermal BBr3 diffusion process is demonstrated. The thickness of the a-Si layer and the temperature of the boron diffusion are optimized in terms of suppressing carrier recombination and transport losses. Different interfacial layers are studied, including ultra-thin SiOx grown either chemically or thermally, and stacks of SiOx and SiNx. While the double SiOx/SiNx interlayers do not achieve the desired performance, both kinds of single SiOx layers produce satisfactory passivating contacts, with both a low recombination current and a low contact resistivity. By adjusting the boron diffusion temperature, recombination current parameter J0 values of ∼ 16 fA/cm2 to ∼30 fA/cm2 have been obtained for structures with initial a-Si thicknesses of 36-46 nm, together with a contact resistivity of ∼8 mΩ cm2.
Original language | English |
---|---|
Pages (from-to) | 73-79 |
Number of pages | 7 |
Journal | Solar Energy Materials and Solar Cells |
Volume | 152 |
DOIs | |
Publication status | Published - 1 Aug 2016 |