TY - GEN
T1 - Performance analysis of a planar microphone array for three dimensional soundfield analysis
AU - Samarasinghe, Prasanga N.
AU - Chen, Hanchi
AU - Fahim, Abdullah
AU - Abhayapala, Thushara D.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/7
Y1 - 2017/12/7
N2 - Soundfield analysis based on spherical harmonic decomposition has been widely used in various applications. However, a major drawback of this method is the requirement of spherical or alternate 3D array geometries, which are often considered to be bulky. Recently, the design of a 2D planar microphone array capable of capturing 3D spatial soundfields was proposed. This design utilizes omnidirectional and differential microphones to capture soundfield components that are undetectable to conventional planar omnidirectional microphone arrays, thus providing the same functionality as spherical arrays designed for the same purpose. In this paper, we discuss the implementation and performance analysis of the above design with real audio recordings. We also compare the results with a commercially available spherical microphone array called the Eigenmike.
AB - Soundfield analysis based on spherical harmonic decomposition has been widely used in various applications. However, a major drawback of this method is the requirement of spherical or alternate 3D array geometries, which are often considered to be bulky. Recently, the design of a 2D planar microphone array capable of capturing 3D spatial soundfields was proposed. This design utilizes omnidirectional and differential microphones to capture soundfield components that are undetectable to conventional planar omnidirectional microphone arrays, thus providing the same functionality as spherical arrays designed for the same purpose. In this paper, we discuss the implementation and performance analysis of the above design with real audio recordings. We also compare the results with a commercially available spherical microphone array called the Eigenmike.
UR - http://www.scopus.com/inward/record.url?scp=85042358077&partnerID=8YFLogxK
U2 - 10.1109/WASPAA.2017.8170033
DO - 10.1109/WASPAA.2017.8170033
M3 - Conference contribution
T3 - IEEE Workshop on Applications of Signal Processing to Audio and Acoustics
SP - 249
EP - 253
BT - 2017 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics, WASPAA 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics, WASPAA 2017
Y2 - 15 October 2017 through 18 October 2017
ER -