Precipitation of interstitial iron in multicrystalline silicon

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    Abstract

    The internal gettering of iron in silicon via iron precipitation at low processing temperatures is known to improve solar cell efficiencies. Studies have found that the optimal temperature lies in the range of 500°C-600°C. In this paper, we present experimental results on quantitatively analysing the precipitation of interstitial Fe in multicrystalline silicon wafers during the 500°C-600°C thermal annealing processes. The concentration and the spatial distribution of interstitial Fe in mc-Si were measured by the photoluminescence imaging technique. It was found that, apart from the processing temperature, the Fe precipitation time constant is highly dependent on the supersaturation ratio and the density and types of the precipitation sites.

    Original languageEnglish
    Title of host publicationGettering and Defect Engineering in Semiconductor Technology XV
    PublisherTrans Tech Publications Ltd.
    Pages34-39
    Number of pages6
    ISBN (Print)9783037858240
    DOIs
    Publication statusPublished - 2014
    Event15th Gettering and Defect Engineering in Semiconductor Technology, GADEST 2013 - Oxford, United Kingdom
    Duration: 22 Sept 201327 Sept 2013

    Publication series

    NameSolid State Phenomena
    Volume205-206
    ISSN (Print)1012-0394

    Conference

    Conference15th Gettering and Defect Engineering in Semiconductor Technology, GADEST 2013
    Country/TerritoryUnited Kingdom
    CityOxford
    Period22/09/1327/09/13

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