Processing sequence for non-destructive inspection based on 3D terahertz images

H. Balacey, Jean Baptiste Perraud, J. Bou Sleiman, Jean Paul Guillet, B. Recur*, P. Mounaix

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    4 Citations (Scopus)

    Abstract

    In this paper we present an innovative data and image processing sequence to perform non-destructive inspection from 3D terahertz (THz) images. We develop all the steps starting from a 3D tomographic reconstruction of a sample from its radiographs acquired with a monochromatic millimetre wave imaging system. Thus an automated segmentation provides the different volumes of interest (VOI) composing the sample. Then a 3D visualization and dimensional measurements are performed on these VOI, separately, in order to provide an accurate nondestructive testing (NDT) of the studied sample. This sequence is implemented onto an unique software and validated through the analysis of different objects.

    Original languageEnglish
    Title of host publicationInfrared, Millimeter-Wave, and Terahertz Technologies III
    EditorsXi-Cheng Zhang, Masahiko Tani, Cunlin Zhang, Xi-Cheng Zhang
    PublisherSPIE
    ISBN (Electronic)9781628413489
    DOIs
    Publication statusPublished - 2014
    EventInfrared, Millimeter-Wave, and Terahertz Technologies III - Beijing, China
    Duration: 9 Oct 201410 Oct 2014

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume9275
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X

    Conference

    ConferenceInfrared, Millimeter-Wave, and Terahertz Technologies III
    Country/TerritoryChina
    CityBeijing
    Period9/10/1410/10/14

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