Seiberg-Witten-Floer Homology and Gluing Formulae

Alan L. Carey; Bai Ling Wang

doi:10.1007/s10114-003-0262-6

Seiberg-Witten-Floer Homology and Gluing Formulae

Alan L. Carey^*, Bai Ling Wang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

This paper gives a detailed construction of Seiberg-Witten-Floer homology for a closed oriented 3-manifold with a non-torsion Spin^c structure. Gluing formulae for certain 4-dimensional manifolds splitting along an embedded 3-manifold are obtained.

Original language	English
Pages (from-to)	245-296
Number of pages	52
Journal	Acta Mathematica Sinica, English Series
Volume	19
Issue number	2
DOIs	https://doi.org/10.1007/s10114-003-0262-6
Publication status	Published - Apr 2003

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title = "Seiberg-Witten-Floer Homology and Gluing Formulae",

abstract = "This paper gives a detailed construction of Seiberg-Witten-Floer homology for a closed oriented 3-manifold with a non-torsion Spinc structure. Gluing formulae for certain 4-dimensional manifolds splitting along an embedded 3-manifold are obtained.",

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AU - Carey, Alan L.

AU - Wang, Bai Ling

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AB - This paper gives a detailed construction of Seiberg-Witten-Floer homology for a closed oriented 3-manifold with a non-torsion Spinc structure. Gluing formulae for certain 4-dimensional manifolds splitting along an embedded 3-manifold are obtained.

KW - 3-Manifolds

KW - Gluing formulae

KW - Seiberg-Witten invariants

KW - Seiberg-Witten-Floer homology

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DO - 10.1007/s10114-003-0262-6

M3 - Article

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JO - Acta Mathematica Sinica, English Series

JF - Acta Mathematica Sinica, English Series

IS - 2

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Seiberg-Witten-Floer Homology and Gluing Formulae

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