Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

DIMITARS JEVTICS; JACK A. SMITH; JOHN MCPHILLIMY; BENOIT GUILHABERT; PAUL HILL; CHARALAMBOS KLITIS; ANTONIO HURTADO; MARC SOREL; HARK HOE TAN; CHENNUPATI JAGADISH; MARTIN D. DAWSON; MICHAEL J. STRAIN

doi:10.1364/OME.432751

Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

DIMITARS JEVTICS^*, JACK A. SMITH, JOHN MCPHILLIMY, BENOIT GUILHABERT, PAUL HILL, CHARALAMBOS KLITIS, ANTONIO HURTADO, MARC SOREL, HARK HOE TAN, CHENNUPATI JAGADISH, MARTIN D. DAWSON, MICHAEL J. STRAIN

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

Original language	English
Journal	Optical Materials Express
Volume	11
Issue number	10 October
DOIs	https://doi.org/10.1364/OME.432751
Publication status	Published - 1 Oct 2021

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JEVTICS, DIMITARS., SMITH, JACK. A., MCPHILLIMY, JOHN., GUILHABERT, BENOIT., HILL, PAUL., KLITIS, CHARALAMBOS., HURTADO, ANTONIO., SOREL, MARC., TAN, HARK. HOE., JAGADISH, CHENNUPATI., DAWSON, MARTIN. D., & STRAIN, MICHAEL. J. (2021). Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing. Optical Materials Express, 11(10 October). https://doi.org/10.1364/OME.432751

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title = "Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing",

abstract = "The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.",

author = "DIMITARS JEVTICS and SMITH, {JACK A.} and JOHN MCPHILLIMY and BENOIT GUILHABERT and PAUL HILL and CHARALAMBOS KLITIS and ANTONIO HURTADO and MARC SOREL and TAN, {HARK HOE} and CHENNUPATI JAGADISH and DAWSON, {MARTIN D.} and STRAIN, {MICHAEL J.}",

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JEVTICS, DIMITARS, SMITH, JACKA, MCPHILLIMY, JOHN, GUILHABERT, BENOIT, HILL, PAUL, KLITIS, CHARALAMBOS, HURTADO, ANTONIO, SOREL, MARC, TAN, HARKHOE , JAGADISH, CHENNUPATI, DAWSON, MARTIND & STRAIN, MICHAELJ 2021, 'Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing', Optical Materials Express, vol. 11, no. 10 October. https://doi.org/10.1364/OME.432751

TY - JOUR

T1 - Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

AU - JEVTICS, DIMITARS

AU - SMITH, JACK A.

AU - MCPHILLIMY, JOHN

AU - GUILHABERT, BENOIT

AU - HILL, PAUL

AU - KLITIS, CHARALAMBOS

AU - HURTADO, ANTONIO

AU - SOREL, MARC

AU - TAN, HARK HOE

AU - JAGADISH, CHENNUPATI

AU - DAWSON, MARTIN D.

AU - STRAIN, MICHAEL J.

PY - 2021/10/1

Y1 - 2021/10/1

N2 - The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

AB - The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

UR - http://www.scopus.com/inward/record.url?scp=85116665600&partnerID=8YFLogxK

U2 - 10.1364/OME.432751

DO - 10.1364/OME.432751

M3 - Article

SN - 2159-3930

VL - 11

JO - Optical Materials Express

JF - Optical Materials Express

IS - 10 October

ER -

Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

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