Abstract
Time-resolved reflectivity (TRR), Rutherford backscattering and channelling spectrometry (RBS-C) and transmission electron microscopy (TEM) were employed to study the in-situ crystallization behaviour and post-anneal defect structures in Ge implanted Si samples annealed at 600 °C. Particular attention was directed at Ge concentrations above the critical concentration for the growth of fully strained layers. Strain relief is shown to be correlated with a sudden reduction in crystallization velocity caused by roughening of the crystalline/amorphous interface.
Original language | English |
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Pages (from-to) | 507-512 |
Number of pages | 6 |
Journal | Materials Science Forum |
Volume | 143-4 |
Issue number | pt 1 |
Publication status | Published - 1994 |
Event | Proceedings of the 17th International Conference on Defects in Semiconductors. Part 1 (of 3) - Gmunden, Austria Duration: 18 Jul 1993 → 23 Jul 1993 |