Strain relaxation during epitaxial crystallization of GexSi1-x alloy layers produced by ion-implantation

R. G. Elliman*, W. C. Wong

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

4 Citations (Scopus)

Abstract

Time-resolved reflectivity (TRR), Rutherford backscattering and channelling spectrometry (RBS-C) and transmission electron microscopy (TEM) were employed to study the in-situ crystallization behaviour and post-anneal defect structures in Ge implanted Si samples annealed at 600 °C. Particular attention was directed at Ge concentrations above the critical concentration for the growth of fully strained layers. Strain relief is shown to be correlated with a sudden reduction in crystallization velocity caused by roughening of the crystalline/amorphous interface.

Original languageEnglish
Pages (from-to)507-512
Number of pages6
JournalMaterials Science Forum
Volume143-4
Issue numberpt 1
Publication statusPublished - 1994
EventProceedings of the 17th International Conference on Defects in Semiconductors. Part 1 (of 3) - Gmunden, Austria
Duration: 18 Jul 199323 Jul 1993

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