Temperature dependence of blistering in hydrogen implanted Si and Ge

D. J. Pyke, R. G. Elliman*, J. C. McCallum

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    The temperature dependence of hydrogen blistering rates are measured in (100) Si, (111) Si and (100) Ge substrates implanted with 40 keV H-ions to a fluence of 6 × 1016 H cm-2 using real-time imaging of samples during annealing. The time taken for blisters to form was found to exhibit Arrhenius behaviour and to be characterised by a single activation energy over the temperature range examined (375-650 °C for Si and 300-600 °C for Ge). The extracted activation energies, which are believed to be the sum of a hydrogen-complex (H-X) dissociation energy and a hydrogen migration energy, were found to be 2.28 ± 0.03 eV for (100) and (111) Si and 1.4 ± 0.03 eV for (100) Ge. These results are discussed with reference to a model for blister formation and compared with previously reported measurements. Crown

    Original languageEnglish
    Pages (from-to)29-32
    Number of pages4
    JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
    Volume307
    DOIs
    Publication statusPublished - 2013

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