The choice of silicon wafer for the production of low-cost rear-contact solar cells

Keith R. McIntosh*, Michael J. Cudzinovic, David D. Smith, William P. Mulligan, Richard M. Swanson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

86 Citations (Scopus)

Abstract

SunPower manufactures high-efficiency rear-contact solar cells. To offer these cells at a competitive price, SunPower requires a source of low-cost wafers with the necessary lifetime, thickness and resistivity to attain a cell efficiency of at least 20%. With simulation and experiment, this paper investigates how each of these parameters affects the efficiency of SunPower's low-cost, rear-contact solar cell. It concludes that the cell efficiency approaches an optimum when the wafers have (i) a lifetime in excess of 1 ms, (ii) a thickness of 160-280 μm, and (iii) a resistivity of 2-10 Omega;.cm (n-type). The requirement of the high lifetime restricts the wafer choice to FZ, PV-FZ or n-type Cz; but the wide tolerance on wafer thickness and resistivity help lower the wafer cost by maximising the yield from a silicon ingot.

Original languageEnglish
Title of host publicationProceddings of the 3rd World Conference on Photovoltaic Energy Conversion
EditorsK. Kurokawa, L.L. Kazmerski, B. McNeils, M. Yamaguchi, C. Wronski
Pages971-974
Number of pages4
Publication statusPublished - 2003
Externally publishedYes
EventProceddings of the 3rd World Conference on Photovoltaic Energy Conversion - Osaka, Japan
Duration: 11 May 200318 May 2003

Publication series

NameProceedings of the 3rd World Conference on Photovoltaic Energy Conversion
VolumeA

Conference

ConferenceProceddings of the 3rd World Conference on Photovoltaic Energy Conversion
Country/TerritoryJapan
CityOsaka
Period11/05/0318/05/03

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