The effect of crystal orientation on thermal shock-induced fracture and properties of ion implanted sapphire

V. N. Gurarie*, P. H. Otsuka, D. N. Jamieson, J. S. Williams, M. Conway

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    Ion beam modification of thermal shock resistance of sapphire single crystals with various crystallographic faces is experimentally investigated. The temperature threshold of fracture is determined in both implanted and unimplanted crystals by measuring the fragment contraction on cooling from fracture temperature. Optical and SEM microscopy are used to analyse fracture morphology and thermal shock behaviour on the (0 0 0 1), (1 1̄ 0 2) and (1 1 2̄ 0) faces in sapphire crystals implanted with 70 keV Si- ions and then subjected to thermal stress testing using pulsed plasma. The most stable crystal faces in terms of stress resistance are established. Ion implantation is shown to reduce the temperature threshold of fracture for all faces tested. The (1 1̄ 0 2) face proved to be the most stable for both implanted and unimplanted crystals. The results are discussed on the basis of fracture mechanics principles and the implantation-induced crack nucleation process.

    Original languageEnglish
    Pages (from-to)751-755
    Number of pages5
    JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
    Volume190
    Issue number1-4
    DOIs
    Publication statusPublished - May 2002

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