The Impact of N2 Anneal on Laser Processed Silicon

Lujia Xu*, Klaus Weber, Xinbo Yang, Andreas Fell, Evan Franklin

*Corresponding author for this work

    Research output: Contribution to journalConference articlepeer-review

    Abstract

    In this paper, the impact of the N2 anneal on laser processed silicon was investigated using photoluminescence (PL) imaging through comparing the PL signal of laser processed samples before and after N2 anneal. The samples capped with different dielectrics or without any dielectric (bare surface) prior to the laser processing were used, enabling the evaluation of the influence of the N2 anneal on the defects caused both by laser thermal effect and by the existence of dielectrics. Generally, it was found that N2 anneal is an effective way to reduce both the laser and dielectric induced defects.

    Original languageEnglish
    Pages (from-to)759-765
    Number of pages7
    JournalEnergy Procedia
    Volume77
    DOIs
    Publication statusPublished - 2015
    Event5th International Conference on Silicon Photovoltaics, SiliconPV 2015 - Konstanz, Germany
    Duration: 25 Mar 201527 Mar 2015

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