Thermal annealing of waveguides formed by ion implantation of silica-on-Si

C. M. Johnson*, M. C. Ridgway, A. Kurver, P. W. Leech, P. J. Simpson

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    2 Citations (Scopus)

    Abstract

    Buried channel waveguides have been fabricated by ion implantation of Plasma-enhanced chemical vapour deposition (PECVD)-grown silica-on-Si. Post-implantation annealing was observed to have a significant influence on waveguide loss as measured at a wavelength of 1550 nm-loss decreased abruptly from an as-implanted value of ∼1 dB/cm to ∼0.15 dB/cm following a 400°C/h annealing cycle. However, annealing at greater temperatures (500°C) yielded a value comparable to the as-implanted result. For the present paper, the various factors that potentially influenced the observed loss behaviour have been addressed. Such factors included thermally-induced changes to density and refractive index, mode profile spreading and subsequent interaction with the waveguide surface, precipitation of the implanted ions and annealing of both intrinsic and implantation-induced defects. The observed loss behaviour has been attributed to a combination of effects dominated by a reduction in implantation-induced defect concentrations (300-400°C), where such defects acted as scattering and/or absorption centres, and mode profile spreading (400-600°C) due to a reduction in refractive index.

    Original languageEnglish
    Pages (from-to)670-674
    Number of pages5
    JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
    Volume141
    Issue number1-4
    DOIs
    Publication statusPublished - May 1998

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