Thermal Conductivity of BN-Based Polymer Composites for Thermal Interface Management: Progress and Applications

Advanced electronic technology significantly relies on the superior heat-conducting materials to efficiently manage the heat generated by circuit assemblies. Effective thermal management is essential to ensure the reliability, efficiency, and durability of electronic devices. The thermal conductivity (TC) of polymers can be improved by initiating several nanofillers and constructing a three-dimensional (3D) conductive path for phonon transfer. In this review, we discussed the synthesis of boron nitride (BN), the thermal characteristics of BN, and BN filler in polymer matrix for enhanced TC. It is summarized that the TC of the polymer composites could be enhanced in case when matrix is added with BN nanosheets (BNNSs) through bidirectional freezing, hot pressing, roll cutting, and making the 3D structure of reinforcement, making it suitable for the applications of electronic packaging. Also, hybrid fillers such as short carbon fiber, BN nanotubes (BNNTs), and nanosheets may construct a highly conductive path for phonon transfer. In addition, we highlighted the challenges and provided the prospects of BN nanostructures in various applications of thermal management to enhance the functional capability of equipment and electronic gadgets.