Thin silicon cells using novel LASE process

K. J. Weber*, A. W. Blakers, M. J. Stocks, P. J. Verlinden

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    4 Citations (Scopus)

    Abstract

    We present a new concept for thin silicon solar cells. In the LASE process (Lateral Anisotropic Silicon Etching) shallow grooves are cut into a (111) oriented silicon wafer at regular intervals. Using alkaline etching, lateral channels are formed which extend underneath the silicon wafer and eventually meet to detach the silicon layer on top. Unlike other liftoff techniques, no silicon deposition is required. The technique can be used to produce silicon strips as well as continuous sheets. Silicon strips can be used to fabricate monolithically connected solar cells and high voltage, low current modules.

    Original languageEnglish
    Title of host publicationProceddings of the 3rd World Conference on Photovoltaic Energy Conversion
    EditorsK. Kurokawa, L.L. Kazmerski, B. McNeils, M. Yamaguchi, C. Wronski
    Pages1262-1264
    Number of pages3
    Publication statusPublished - 2003
    EventProceddings of the 3rd World Conference on Photovoltaic Energy Conversion - Osaka, Japan
    Duration: 11 May 200318 May 2003

    Publication series

    NameProceedings of the 3rd World Conference on Photovoltaic Energy Conversion
    VolumeB

    Conference

    ConferenceProceddings of the 3rd World Conference on Photovoltaic Energy Conversion
    Country/TerritoryJapan
    CityOsaka
    Period11/05/0318/05/03

    Fingerprint

    Dive into the research topics of 'Thin silicon cells using novel LASE process'. Together they form a unique fingerprint.

    Cite this