Ti/Ni/Au contacts to n-SiC after low energy implantation

Patrick W. Leech*, Anthony S. Holland, Geoffrey K. Reeves, Yue Pan, Mark Ridgway, Phillip Tanner

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    2 Citations (Scopus)

    Abstract

    The effect of low energy implantation of P or C ions in 3 C-SiC on the properties of Ti/Ni/Au contacts has been examined for doses in the range 1013-1015 ions/cm2. Measurements of specific contact resistance, ρc, were performed using the two-contact circular test structure. The magnitude of ρc for the Ti/Ni/Au contacts on unimplanted SiC was 1.29×10-6 Ω cm2. The value of ρc increased significantly at an implant dose of 1×1015 ions/cm2. The dependence of Rsh and ρc on ion dose has been measured using both C and P implant species.

    Original languageEnglish
    Pages (from-to)39-42
    Number of pages4
    JournalMaterials Letters
    Volume166
    DOIs
    Publication statusPublished - 1 Mar 2016

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