TY - JOUR
T1 - Towards universal plasma-enabled platform for the advanced nanofabrication
T2 - plasma physics level approach
AU - Baranov, O.
AU - Xu, S.
AU - Ostrikov, K.
AU - Wang, B. B.
AU - Cvelbar, U.
AU - Bazaka, K.
AU - Levchenko, I.
N1 - Publisher Copyright:
© 2018, Division of Plasma Physics, Association of Asia Pacific Physical Societies.
PY - 2018/12
Y1 - 2018/12
N2 - Growing demand for efficient, high-resolution surface processing has led to the emergence of a rich variety of plasma-based technologies underpinned by an equally wide range of technological setups, each optimized for a specific task, e.g. highly-selective removal of surface layers, precision surface functionalization and nanoscale structuring, or deposition of thin films and nanostructures. However, with increasing device integration and miniaturization, flexible processing technologies capable of delivering complex treatments, such as the growth of complex hierarchical single- and multi-component nanostructures within a single processing environment are highly desired. Yet, such systems are difficult to achieve due to the necessity of the in-process float, and limiting technological capabilities of individual plasma sources and treatment setups. Using a novel flexible platform as an example, this review presents a careful analysis of the physical principles, capabilities and limitations of existing plasma technologies with an ultimate aim to define key principles for the development of prospective flexible platforms for complex plasma-enabled material synthesis and processing. Such a platform would have a significant potential to increase the effectiveness of plasma technology with respect to productivity, material and energy consumption, cost and turnaround time.
AB - Growing demand for efficient, high-resolution surface processing has led to the emergence of a rich variety of plasma-based technologies underpinned by an equally wide range of technological setups, each optimized for a specific task, e.g. highly-selective removal of surface layers, precision surface functionalization and nanoscale structuring, or deposition of thin films and nanostructures. However, with increasing device integration and miniaturization, flexible processing technologies capable of delivering complex treatments, such as the growth of complex hierarchical single- and multi-component nanostructures within a single processing environment are highly desired. Yet, such systems are difficult to achieve due to the necessity of the in-process float, and limiting technological capabilities of individual plasma sources and treatment setups. Using a novel flexible platform as an example, this review presents a careful analysis of the physical principles, capabilities and limitations of existing plasma technologies with an ultimate aim to define key principles for the development of prospective flexible platforms for complex plasma-enabled material synthesis and processing. Such a platform would have a significant potential to increase the effectiveness of plasma technology with respect to productivity, material and energy consumption, cost and turnaround time.
KW - Advanced materials
KW - Deposition
KW - Plasma technology
KW - Sputtering
UR - http://www.scopus.com/inward/record.url?scp=85050163190&partnerID=8YFLogxK
U2 - 10.1007/s41614-018-0016-7
DO - 10.1007/s41614-018-0016-7
M3 - Review article
AN - SCOPUS:85050163190
SN - 2367-3192
VL - 2
JO - Reviews of Modern Plasma Physics
JF - Reviews of Modern Plasma Physics
IS - 1
M1 - 4
ER -